Shree Ram Pandey¹, Bishakh Bhattacharya¹, AkkarapakamSuneesh Jacob¹ and Rituparna Datta², ¹Indian Institute of Technology Kanpur, India, ²Independent Researcher, India

Artificial Intelligence can be used in design of adaptive structures for data-driven modelling, design of intelligent control algorithms, predictive analytics, and design optimization. Adaptive structures for thermal management of electronic devices refer to systems or components that can dynamically adjust their shape, properties, or configurations to optimize heat dissipation and regulate the temperature in electronic devices. The current study is based on the application of adaptive structures for heat transfer augmentation. These structures are designed to enhance cooling efficiency, prevent overheating, and ensure reliable operation of electronic components. Thermal simulation of adaptive structures is highly interdisciplinary, involving aspects of mechanical engineering, materials science, control systems, and numerical methods. The proposed heat sink changes its shape and hence exposed surface area in accordance with changes insurrounding conditions to cater to variable heat dissipation requirements by various thermal systems. A cylindrical heat sink with radial fins having a unique design feature of variable heat transfer area is studied for thermal performance. The objective of this study includes studying the numerical pattern of the effect on heat dissipation by changing the surface area. Two sets of dimensions of the model are taken for numerical simulation, and the change in heat transfer coefficient with respect to a gradual increase in the surface area is analysed.

Intelligent systems, Adaptive structures, Heat sinks, Variable heat transfer rate, Numerical modelling.